Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd

Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd

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Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material

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Zhuzhou Sanxin Cemented Carbide Manufacturing Co., Ltd
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City:zhuzhou
Province/State:hunan
Country/Region:china
Contact Person:MsAnne Zhang
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Non-magnetic Tungsten Carbide Core Ring with Magnetic Permeability <1.002 and Residual Magnetization <0.05 mT Made from 100% Virgin Material

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Brand Name :Sanxin
Model Number :SX1267
Place of Origin :Zhuzhou,China
MOQ :2
Payment Terms :T/T,Western Union,L/C
Delivery Time :5-25days
Feature :Wear Resistant
Chemical Resistance :Resistant to most acids and alkalis
Usage :Cutting and Drilling
Dimension :Customizable
Surface Treatment :Plain, Blank, Sintered
Lifespa :Long
Chemical Stability :High
Materail :100%vrigin Material
Country Of Origin :China
Standard :ISO, RoHs
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μ-grade non-magnetic tungsten carbide core ring with a magnetic permeability of <1.002 · Special anti-interference material for precision instruments


When precision measurement encounters magnetic field interference—
This non-magnetic core ring, precision-manufactured using nickel-bonded tungsten carbide (WC-Ni), undergoes a special demagnetization process to completely eliminate the magnetic interference issues associated with traditional tungsten steel parts. This ensures zero magnetic interference, high precision, and long-life stable operation in magnetic field-sensitive environments such as MRI medical equipment and semiconductor manufacturing.


Non-Magnetic Principle: A Breakthrough in Materials Science
▸ Non-Magnetic Mechanism:
- Nickel-based binder phase replaces the traditional cobalt phase
- Magnetic permeability controlled to <1.002
- Residual magnetization <0.05 mT


▸ Matrix material: 90% WC + 10% Ni, non-magnetic formula
▸ Hardness: 92 HRA (Vickers hardness 1800 HV)
▸ Density: 14.8-15.1 g/cm³
▸ Resistivity: 0.8-1.2 μΩ·m


Applications:


Consumer electronics manufacturing
Mobile phone camera module soldering
Micro connector soldering
TWS earphone component soldering


Semiconductor packaging
BGA chip packaging soldering
CSP chip-scale packaging
Wafer-level soldering


Automotive electronics
Automotive sensor soldering
ECU control unit soldering
In-vehicle camera modules


Medical electronics
Medical sensor soldering
Implantable device packaging
Diagnostic device manufacturing


Product Specifications:

Parameter Type Specification Value Accuracy Standard
Nominal Aperture 450µm ±1µm
Aperture Circularity ≤0.5µm (inspected by industrial endoscope)
Flow Channel Roughness Ra ≤0.1µm (certified by white light interferometry)
Material Hardness 91.5 HRA (Rockwell hardness tester)
Heat Deflection ≤0.001mm/100°C (tested by thermal expansion tester)

The above data is for reference only. Customization is possible upon request.

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